Imaging apparatus comprising image sensor array having shared global shutter circuitry

ABSTRACT

There is set forth herein in one embodiment an image sensor array including a global shutter shared by first and second pixels. The global shutter can include a charge storage area having an associated shield for reducing charge build up on the charge storage area attributable to incident light rays. There is set forth herein in one embodiment an imaging apparatus having one or more configuration. The one or more configuration can include one or more of a configuration wherein a frame read out from an image sensor array has unbinned pixel values, a configuration wherein a frame read out from an image sensor array has binned pixel values corresponding to an M×N, M&gt;=2, N&gt;=2 arrangement of pixel values, and a configuration wherein a frame read out from an image sensor array has binned pixel values corresponding to a 1×N, N&gt;=2 arrangement of pixel values.

CROSS REFERENCE TO RELATED APPLICATIONS

The present application claims the benefit of U.S. patent applicationSer. No. 13/289,795 for an Imaging Apparatus Comprising Image SensorArray Having Shared Global Shutter Circuitry filed Nov. 4, 2011 (andpublished on May 9, 2013 as U.S. Patent Publication No. 2013/0112753),now U.S. Pat. No. 8,629,926. The present application is related to U.S.patent application Ser. No. 13/289,778 for an Apparatus Comprising ImageSensor Array Having Global Shutter Shared by a Plurality of Pixels filedon Nov. 4, 2011. Each of the foregoing patent applications, patentpublication, and patent is hereby incorporated by reference in itsentirety.

FIELD OF THE INVENTION

The present invention relates in general to optical based apparatus, andparticularly is related to an image sensor array based apparatus.

BACKGROUND

Image sensor integrated circuits having multiple pixel image sensorarrays are commercially available. Imaging apparatus having image sensorarrays are available in a variety of forms, including digital cameras,mobile phones, surveillance equipment, medical diagnostic equipment, andindicia decoding apparatus. Imaging apparatuses are available in formswith indicia decoding capability and without decoding capability.Imaging apparatus with indicia decoding capability can be regarded asindicia reading apparatus.

Indicia reading apparatus for reading decodable indicia are available inmultiple varieties. For example, minimally featured indicia readingapparatus devoid of a keyboard and display are common in point of saleapplications. Indicia reading apparatus devoid of a keyboard and displayare available in the recognizable gun style form factor having a handleand trigger button (trigger) that can be actuated by an index finger.Indicia reading apparatus having keyboards and displays are alsoavailable, often in a form where a keyboard and display is commonlylocated by the providing of a touch screen type display. Keyboard anddisplay equipped indicia reading apparatus are commonly used in retail,shipping and warehouse applications. In a keyboard and display equippedindicia reading apparatus, a trigger button for actuating the output ofdecoded messages is typically provided in such locations as to enableactuation by a thumb of an operator. Indicia reading apparatus in a formdevoid of a keyboard and display or in a keyboard and display equippedform are commonly used in a variety of data collection applicationsincluding retail point of sale applications, retail inventoryapplications, shipping applications, warehousing applications, securitycheck point applications, patient care applications, and personal use,common where keyboard and display equipped indicia reading apparatus isprovided by a personal mobile telephone having indicia readingfunctionality. Fixed mount indicia reading apparatus are also commonlyavailable, e.g., installed under or near a countertop at a point ofsale. Some indicia reading apparatus are adapted to read bar codesymbols including one or more of one dimensional (1D) bar codes, stacked1D bar codes, and two dimensional (2D) bar codes. Other indicia readingapparatus are adapted to read OCR characters while still other indiciareading apparatus are equipped to read both bar code symbols and OCRcharacters.

BRIEF DESCRIPTION OF THE DRAWINGS

The features described herein can be better understood with reference tothe drawings described below. The drawings are not necessarily to scale,emphasis instead generally being placed upon illustrating the principlesof the invention. In the drawings, like numerals are used to indicatelike parts throughout the various views.

FIG. 1 is a schematic physical form view of an indicia reading apparatusin one embodiment;

FIG. 2 is a block diagram of an indicia reading apparatus in oneembodiment;

FIG. 3 is an exploded assembly perspective view of an imaging module;

FIG. 4 is a perspective view of an imaging module;

FIG. 5 is an implementation view illustrating an imaging apparatusprovide by a fixed mount indicia reading apparatus mounted at acountertop at a point of sale checkout station;

FIG. 6 is a timing diagram illustrating a method which can be performedby an imaging apparatus;

FIG. 7 is an electrical block diagram illustrating an embodiment of animage sensor array;

FIG. 8 is a timing diagram illustrating operation of an apparatusaccording to a rolling reset (shutter) configuration;

FIG. 9 is a timing diagram illustrating operation of an apparatusaccording to a 2×2 binning global shutter configuration;

FIG. 10 is a timing diagram illustrating operation of an apparatus inaccordance with a 1×2 binning global shutter interlacing configuration;

FIG. 11 is an electrical block diagram illustrating an embodiment of animage sensor array;

FIG. 12 is a timing diagram illustrating operation of an apparatusaccording to a 1×4 binning global shutter configuration;

FIG. 13 is a timing diagram illustrating a method that can be performedby an imaging apparatus.

SUMMARY

There is set forth herein in one embodiment an image sensor arrayincluding a global shutter shared by first and second pixels. The globalshutter can include a charge storage area having an associated shieldfor reducing charge build up on the charge storage area attributable toincident light rays. There is set forth herein in one embodiment animaging apparatus having one or more configuration. The one or moreconfiguration can include one or more of a configuration wherein a frameread out from an image sensor array has unbinned pixel values, aconfiguration wherein a frame read out from an image sensor array hasbinned pixel values corresponding to an M×N, M>=2, N>=2 arrangement ofpixel values, and a configuration wherein a frame read out from an imagesensor array has binned pixel values corresponding to a 1×N, N>=2arrangement of pixel values.

DETAILED DESCRIPTION

Referring to FIG. 1, there is set forth herein an apparatus provided byan image sensor array 1033 that includes a global shutter 6028 shared byfirst and second pixels 6011 and 6012. Global shutter 6028 can includecharge storage area 6029 and shield 6030. The charge storage area 6029can include an associated opaque shield 6030 for reducing charge buildup on storage area 6029 attributable to light being incident on chargestorage area 6029. In one embodiment, image sensor array 1033 caninclude a plurality of cells 6000. Each cell 6000 can have a globalshutter 6028 shared by first and second pixels. Global shutter 6028 caninclude charge storage area 6029 shared by first and second pixels, andan opaque shield 6030 associated with the charge storage area 6029. Inone embodiment, image sensor array 1033 can be incorporated as an imagesensor integrated circuit 1040. In one embodiment, image sensor array1033 can be disposed in imaging apparatus 1000. Imaging apparatus 1000can take on a variety of forms. In the embodiment of FIG. 1, imagingapparatus 1000 is shown as being provided by an image sensor basedindicia reading apparatus. First and second pixels can be regarded assharing a global shutter if there is an instance in the operation ofarray 1033 in which charge from the first pixel is transferred to thecharge storage area of the global shutter and an instance in theoperation of array 1033 in which charge from the second pixel istransferred to the charge storage area of the global shutter. Theinstances can be simultaneous or sequential.

An exemplary hardware platform for support of operations describedherein with reference to an exemplary image sensor array based imagingapparatus 1000 is shown and described with reference to FIG. 2.

Imaging apparatus 1000 can include an image sensor 1032 comprising amultiple pixel image sensor array 1033 having pixels arranged in rowsand columns of pixels, associated column circuitry 1034 and rowcircuitry 1035. Associated with the image sensor 1032 can be arrayamplifier circuitry 1036 (amplifier), and an analog to digital converter1037 which converts image information in the form of analog signals readout of image sensor array 1033 into image information in the form ofdigital signals. Image sensor 1032 can also have an associated timingand control circuit 1038 for use in controlling e.g., the exposureperiod of image sensor 1032, gain applied to the amplifier 1036. Thenoted circuit components 1032, 1036, 1037, and 1038 can be packaged intoa common image sensor integrated circuit 1040. Image sensor integratedcircuit 1040 can incorporate fewer than the noted number of components.In one example, image sensor integrated circuit 1040 can include imagesensor 1032 without including elements 1035, 1036, 1037 and 1038.

In one example, image sensor integrated circuit 1040 can have an imagesensor array 1033 that includes a plurality of cells, e.g., cells 6000.Cells of the plurality of cells can include first and second pixels6011, 6012 sharing a common global shutter 6028. Global shutter 6028 caninclude a common charge storage area 6029 and opaque shield 6030. Opaqueshield 6030 can reduce a charge build up on charge storage area 6029attributable to light rays being incident on charge storage area 6029.

In one example, image sensor integrated circuit 1040 can incorporate aBayer pattern filter, so that defined at the image sensor array 1033 arered pixels at red pixel positions, green pixels at green pixelpositions, and blue pixels at blue pixel positions. Frames that can becaptured utilizing an image sensor array 1033 incorporating a Bayerpattern can include red pixel values at red pixel positions, green pixelvalues at green pixel positions, and blue pixel values at blue pixelpositions. In an embodiment incorporating a Bayer pattern image sensorarray, CPU 1060 prior to subjecting a frame to further processing caninterpolate pixel values at frame pixel positions intermediate of greenpixel positions utilizing green pixel values for development of amonochrome frame of image data. Alternatively, CPU 1060 prior tosubjecting a frame for further processing can interpolate pixel valuesintermediate of red pixel positions utilizing red pixel values fordevelopment of a monochrome frame of image data. CPU 1060 canalternatively, prior to subjecting a frame for further processinginterpolate pixel values intermediate of blue pixel positions utilizingblue pixel values. Apparatus 1000 in one aspect can process a raw framecaptured utilizing an image sensor array 1033 having a color filter bysubjecting the raw color frame to a de-mosaicing process. Color imagedata of a frame can be subjected to demosaicing by adding two additionalcolor scale values for each pixel position of the frame. In the caseimage sensor array 1033 includes a Bayer pattern filter, red pixelvalues at green and blue pixel positions can be interpolated utilizingred pixel values at red pixel positions. Blue pixel values at red andgreen pixel positions can be interpolated utilizing blue pixel values atblue pixel positions. Further, green pixel values at red and blue pixelpositions can be interpolated utilizing green pixel values at greenpixel positions. An imaging subsystem of apparatus 1000 can includeimage sensor 1032 and a lens assembly 200 for focusing an image ontoimage sensor array 1033 of image sensor 1032.

In the course of operation of apparatus 1000, image signals can be readout of image sensor 1032, converted, and stored into a system memorysuch as RAM 1080. A memory 1085 of apparatus 1000 can include RAM 1080,a nonvolatile memory such as EPROM 1082 and a storage memory device 1084such as may be provided by a flash memory or a hard drive memory. In oneembodiment, apparatus 1000 can include CPU 1060 which can be adapted toread out image data stored in memory 1080 and subject such image data tovarious image processing algorithms. Apparatus 1000 can include a directmemory access unit (DMA) 1070 for routing image information read outfrom image sensor 1032 that has been subject to conversion to RAM 1080.In another embodiment, apparatus 1000 can employ a system bus providingfor bus arbitration mechanism (e.g., a PCI bus) thus eliminating theneed for a central DMA controller. A skilled artisan would appreciatethat other embodiments of the system bus architecture and/or directmemory access components providing for efficient data transfer betweenthe image sensor 1032 and RAM 1080 are within the scope and the spiritof the invention.

Referring to further aspects of apparatus 1000, imaging lens assembly200 can be adapted for focusing an image of a decodable indicia 15located within a field of view 1240 on a substrate, T, onto image sensorarray 1033. A size in target space of a field of view 1240 of apparatus1000 can be varied in a number of alternative ways. A size in targetspace of a field of view 1240 can be varied, e.g., by changing anapparatus to target distance, changing an imaging lens assembly setting,changing a number of pixels of image sensor array 1033 that are subjectto read out. Imaging light rays can be transmitted about imaging axis25. Lens assembly 200 can be adapted to be capable of multiple focallengths and multiple planes of optimum focus (best focus distances).

Apparatus 1000 can include an illumination assembly 800 for illuminationof target, T, which can be provided by a substrate and projection of anillumination pattern 1260. Illumination pattern 1260, in the embodimentshown can be projected to be proximate to but larger than an areadefined by field of view 1240, but can also be projected in an areasmaller than an area defined by a field of view 1240. Illuminationassembly 800 can include a light source bank 500, comprising one or morelight sources. A physical form view of an example of an illuminationsubsystem is shown in FIGS. 3-4. As shown in FIGS. 3-4, an imagingmodule 400 can be provided having a circuit board 402 carrying imagesensor 1032 and lens assembly 200 disposed in support 430 disposed oncircuit board 402. In the embodiment of FIGS. 3 and 4, illuminationassembly 800 has a light source bank 500 provided by single light source502. In another embodiment, light source bank 500 can be provided bymore than one light source. Apparatus 1000 can also include an aimingassembly 600 for projecting an aiming pattern (not shown). Aimingassembly 600 which can comprise a light source bank can be coupled toaiming light source bank power input unit 1208 for providing electricalpower to a light source bank of aiming assembly 600. Power input unit1208 can be coupled to system bus 1500 via interface 1108 forcommunication with CPU 1060. An imaging module apparatus as shown inFIGS. 3 and 4 can be e.g., disposed in a hand held housing 1014 as shownin FIG. 1 or fixed positioned at fixed mounted at a scanning location480 which can be provided, e.g., by a checkout counter or a ceilingabove a conveyor belt.

In one embodiment, illumination assembly 800 can include, in addition tolight source bank 500, an illumination lens assembly 300, as is shown inthe embodiment of FIG. 2. In addition to or in place of illuminationlens assembly 300 illumination assembly 800 can include alternativelight shaping optics, e.g. one or more diffusers, mirrors and prisms. Inuse, apparatus 1000 can be oriented by an operator with respect to atarget, T, (e.g., a piece of paper, a package, another type ofsubstrate) bearing decodable indicia 15 in such manner that illuminationpattern 1260 is projected on a decodable indicia 15. In the example ofFIG. 2, decodable indicia 15 is provided by a 1D bar code symbol.Decodable indicia 15 could also be provided by a 2D bar code symbol oroptical character recognition (OCR) characters.

Referring to further aspects of apparatus 1000, lens assembly 200 can becontrolled with use of electrical power input unit 1202 which providesenergy for changing a plane of optimum focus of lens assembly 200. Inone embodiment, an electrical power input unit 1202 can operate as acontrolled voltage source, and in another embodiment, as a controlledcurrent source. Electrical power input unit 1202 can apply signals forchanging optical characteristics of lens assembly 200, e.g., forchanging a focal length and/or a best focus distance of (a plane ofoptimum focus of) lens assembly 200. Light source bank electrical powerinput unit 1206 can provide energy to light source bank 500. In oneembodiment, electrical power input unit 1206 can operate as a controlledvoltage source. In another embodiment, electrical power input unit 1206can operate as a controlled current source. In another embodimentelectrical power input unit 1206 can operate as a combined controlledvoltage and controlled current source. Electrical power input unit 1206can change a level of electrical power provided to (energization levelof) light source bank 500, e.g., for changing a level of illuminationoutput by light source bank 500 of illumination assembly 800 forgenerating illumination pattern 1260.

In another aspect, apparatus 1000 can include power supply 1402 thatsupplies power to a power grid 1404 to which electrical components ofapparatus 1000 can be connected. Power supply 1402 can be coupled tovarious power sources, e.g., a battery 1406, a serial interface 1408(e.g., USB, RS232), and/or AC/DC transformer 1410.

Further regarding power input unit 1206, power input unit 1206 caninclude a charging capacitor that is continually charged by power supply1402. Power input unit 1206 can be configured to output energy within arange of energization levels.

Apparatus 1000 can also include a number of peripheral devices includingtrigger 1220 which may be used to make active a trigger signal foractivating frame readout and/or certain decoding processes. Apparatus1000 can be adapted so that activation of trigger 1220 activates atrigger signal and initiates a decode attempt. Specifically, apparatus1000 can be operative so that in response to activation of a triggersignal, a succession of frames can be captured by way of read out ofimage data from image sensor array 1033 (typically in the form of analogsignals) and then storage of the image data (in the form of digitized Nbit values) after conversion into memory 1080 (which can buffer one ormore of the succession of frames at a given time). CPU 1060 can beoperative to subject one or more of the succession of frames to a decodeattempt.

For attempting to decode a bar code symbol, e.g., a one dimensional barcode symbol, CPU 1060 can process image data of a frame corresponding toa line of pixel positions (e.g., a row, a column, or a diagonal set ofpixel positions) to determine a spatial pattern of dark and light cellsand can convert each light and dark cell pattern determined into acharacter or character string via table lookup. Where a decodableindicia representation is a 2D bar code symbology, a decode attempt cancomprise the steps of locating a finder pattern using a featuredetection algorithm, locating matrix lines intersecting the finderpattern according to a predetermined relationship with the finderpattern, determining a pattern of dark and light cells along the matrixlines, and converting each light pattern into a character or characterstring via table lookup.

Apparatus 1000 can include various interface circuits for couplingvarious of the peripheral devices to system address/data bus (systembus) 1500, for communication with CPU 1060 also coupled to system bus1500. Apparatus 1000 can include interface circuit 1028 for couplingimage sensor timing and control circuit 1038 to system bus 1500,interface circuit 1102 for coupling electrical power input unit 1202 tosystem bus 1500, interface circuit 1106 for coupling illumination lightsource bank power input unit 1206 to system bus 1500, and interfacecircuit 1120 for coupling trigger 1220 to system bus 1500. Apparatus1000 can also include a display 1222 coupled to system bus 1500 and incommunication with CPU 1060, via interface 1122, as well as pointermechanism 1224 in communication with CPU 1060 via interface 1124connected to system bus 1500. Apparatus 1000 can also include rangedetector unit 1210 coupled to system bus 1500 via interface 1110. In oneembodiment, range detector unit 1210 can be an acoustic range detectorunit. Various interface circuits of apparatus 1000 can share circuitcomponents. For example, a common microcontroller can be established forproviding control inputs to both image sensor timing and control circuit1038 and to power input unit 1206. A common microcontroller providingcontrol inputs to circuit 1038 and to power input unit 1206 can beprovided to coordinate timing between image sensor array 1033 controlsand illumination subsystem controls. Apparatus 1000 can comprise one ormore communication interface 1050 in communication with CPU 1060 viasystem bus 1500. Communication interface 1050 can be a wireline orwireless communication interface, e.g., an IEEE 802.11 compliantcommunication interface or a Bluetooth communication interface.

A succession of frames of image data that can be captured and subject tothe described processing can be full pixel resolution full frames(including pixel values corresponding to each pixel of image sensorarray 1033 or a maximum number of pixels read out from image sensorarray 1033 during operation of apparatus 1000). A succession of framesof image data that can be captured and subject to the describedprocessing can also be reduced picture size frames comprising pixelvalues corresponding to less than a maximum and less than each pixel ofimage sensor array 1033. A succession of frames of image data that canbe captured and subject to the described processing can also comprise acombination of full pixel resolution full frames and reduced picturesize frames. A reduced picture size frame can be captured e.g., byperforming binning of the values of adjacent pixels, by skipping readoutof pixels of and/or by selectively reading out pixels one or morediscrete coordinate areas of image sensor array 1033.

An isolated discrete coordinate area of image sensor array 1033 can beregarded as a “window.” A frame having image data corresponding to oneor more window can be regarded as a windowed frame. An example of awindow is a center row of pixels. Another example of a window is N,N≦500 center rows of image sensor array 1033. A read out frame cancomprise one or more window. Pixels corresponding to a full pixelresolution full frame can be read out for capture by selectivelyaddressing pixels of image sensor 1032 having image sensor array 1033corresponding to the full pixel resolution full frame. Pixelscorresponding to a reduced picture size frame can be read out forcapture by selectively addressing pixels of image sensor 1032 havingimage sensor array 1033 corresponding to the pixel positions of thereduced picture size. A reduced picture size frame can also be read outby binning pixels of the image sensor array 1033, i.e., by aggregating(e.g., summing or averaging) values of neighboring pixels. In oneembodiment, a number of pixels subject to addressing and read outdetermine a picture size of a frame. A full pixel resolution full framecan be regarded as having a first relatively larger picture size and awindowed frame can be regarded as having a relatively smaller picturesize relative to a picture size of a full pixel resolution full frame. Apicture size of a windowed frame can vary depending on the number ofpixels subject to addressing for readout and capture of a windowedframe, and also a number of binned pixels within a window. A windowedframe can be a full pixel resolution windowed frame wherein each pixelwithin the window is subject to read out without binning or a reducedresolution windowed frame wherein pixels within a window are skipped forpurposes of read out or alternatively, binned. A reduced resolution fullframe can be captured by reading out each pixel of image sensor array1033 (i.e., reading out an image signal corresponding to a charge) witheach pixel forming a bin with one or more adjacent pixels.

Apparatus 1000 can capture frames of image data at a rate known as aframe rate. A typical frame rate is 60 frames per second (FPS) whichtranslates to a frame time (frame period) of 16.6 ms. Another typicalframe rate is 30 frames per second (FPS) which translates to a frametime (frame period) of 33.3 ms per frame. A frame rate of apparatus 1000can be increased (and frame time decreased) by decreasing of a number ofpixels subject to readout.

Further aspects of apparatus 1000 in one embodiment are described withreference again to FIG. 1. Trigger 1220, display 1222, pointer mechanism1224, and keyboard 1226 can be disposed on a common side of a hand heldhousing 1014 as shown in FIG. 1. Display 1222 and pointer mechanism 1224in combination can be regarded as a user interface of apparatus 1000.Display 1222 in one embodiment can incorporate a touch panel fornavigation and virtual actuator selection in which case a user interfaceof apparatus 1000 can be provided by display 1222 incorporating thenoted touch panel. A display incorporating a touch panel can be regardedas a “touch screen.” A user interface of apparatus 1000 can also beprovided by configuring apparatus 1000 to be operative to bereprogrammed by decoding of programming bar code symbols. A hand heldhousing 1014 for apparatus 1000 can in another embodiment be devoid of adisplay and can be in a gun style form factor. Imaging module 400including image sensor array 1033 and imaging lens assembly 200 can beincorporated in hand held housing 1014. Apparatus 1000 in anotherembodiment can be devoid of housing 1014.

In the implementation view of FIG. 5, indicia reading apparatus 1000having fixed mount housing 1015 and imaging module 400 incorporated inhousing 1015 is shown as being disposed at a point of sale. Indiciareading apparatus 1000 in the implementation view of FIG. 5 is a fixedposition and fixed mount indicia reading apparatus that is mounted at acheckout counter. Indicia reading apparatus 1000 having fixed mounthousing 1015 can also be mounted e.g., at a ceiling above a conveyorbelt. In one embodiment, apparatus 1000 can be devoid of a housing suchas housing 1014 or housing 1015 and can be provided, e.g., by andapparatus having the components of imaging module 400. Referring againto FIG. 2, FIG. 2 includes a dashed border 1014, 1015 indicating thatcomponents depicted within border 1014, 1015 can be disposed within ahousing such as a hand held housing 1014 as depicted in FIG. 1 or afixed mount housing 1015 as depicted in FIG. 5.

A timing diagram illustrating operation of the apparatus 1000 duringperformance of indicia reading operations is shown in FIG. 6. Referringto the timing diagram of FIG. 6, signal 5002 is a trigger signal whichcan be made active, e.g., via actuation of trigger 1220, via power upapparatus 1000, via receipt of a serial command from an externalcomputer. Signal 5102 is an illumination energization level signalhaving varying energization levels. Signal 5202 is an exposure controlsignal having active states defining exposure periods and inactivestates intermediate exposure periods. Signal 5302 is a readout controlsignal. When readout control signal 5302 is active, image data in theform of analog image signals can be read out of image sensor array 1033.For readout of pixel values of image sensor array 1033 as shown in FIG.1, image signals read out can correspond to charge stored at chargestorage areas constructed according to charge storage area 6029 of imagesensor array 1033. Further regarding the timing diagram of FIG. 6,periods 5420-5430 are periods at which CPU 1060 can process frames ofimage data, e.g., for attempting to decode for decodable indicia.Apparatus 1000 can be operative so that prior to exposure period 5220and after time t_(o), apparatus 1000 can be capturing “parameterdetermination” frames that are processed for parameter determinationthat may or may not be subject to decode attempt.

In a particular embodiment as set forth in FIG. 7, there is provided animage sensor array 1033 having a global shutter 6028 including chargestorage area 6029 and opaque shield 6030 shared by a plurality of pixelsincluding first and second pixels 6011, 6012 and third and fourth pixels6013, 6014. A set of P, P>1 pixels sharing a common charge storage areacircuit can be regarded as a cell. By providing an image sensor array inwhich charge storage area 6029 is shared by a plurality of pixels, thetotal number of transistors per pixel of the image sensor array 1033 canbe reduced, resulting in increased fill factor and increased signal tonoise ratio for the image sensor array 1033. In one embodiment, anopaque shield 6030 can be provided for shielding light so that lightrays which would otherwise be incident on charge storage area 6029 arenot incident on charge storage area 6029. Pixels of image sensor array1033 that share a common charge storage area 6029 can be e.g., Bayerpattern color pixels or monochrome pixels. Apparatus 1000 can include atiming and control circuit 1038 that enables several configurations,including: (a) rolling reset (shutter) configuration; (b) 2×2 binningglobal shutter configuration; (c) 1×2 binning global shutter interlacingconfiguration; (d) 2×2 binning rolling reset configuration; (e) 1×2binning rolling reset configuration (f) a 1×N binning global shutterconfiguration.

Referring to image sensor array 1033, image sensor array 1033, asillustrated in the embodiment of FIG. 7, can include a repeating patternof cells 6000. Cells 6000 can be arranged in a plurality of rows andcolumns of cells, and can be characterized by a charge storage area 6029shared by two or more pixels within the cell. As each cell 6000 caninclude first and second rows and first and second columns of pixelsaligned with one or more adjacent cells as illustrated in FIG. 7 todefine rows and columns of adjacent cells, image sensor array 1033 asshown in FIG. 7 can be regarded as having a plurality of rows e.g. rows6220, 6221, 6222, 6223, 6224, 6225, 6226, 6227 and columns e.g., columns6321, 6322, 6323, 6324, 6325, 6326, 6327, 6328 of pixels.

In one example, cells of a repeating pattern of cells can have theelements as shown in FIG. 7. In the diagram of FIG. 7, a first row ofpixels 6002 includes green and red pixels, G, R and a second row ofpixels 6004 includes blue and green pixels, B and G. Pixels P_(x,y),P_(x+1, y), P_(x, y+1), and P_(x+1, y+1) can include respectivephotodiodes 6111, 6112, 6113, 6114 and respective transfer transistors6011, 6012, 6013, 6014. The pixels P_(x,y), P_(x+1, y), P_(x, y+1), andP_(x+1, y+1), in the embodiment of FIG. 7 can share a common globalshutter 6028 comprising a common charge storage area 6029 and opaqueshield 6030. In the embodiment of FIG. 7, charge storage area 6029 canbe provided as part of an amplifier circuit 6020. Pixel amplifiercircuit 6020 in one embodiment can include a charge storage area 6029provided by a floating diffusion, a reset transistor 6022, a selecttransistor 6024 and a detection transistor 6026. Image sensor array 1033can include an opaque shield 6030. Opaque shield 6030 can restrict lightfrom being incident on charge storage area 6029 which can be provided bya floating diffusion thereby reducing an amount of charge build up oncharge storage area 6029 attributable to incident light.

For output of a signal responsive to light incident on a certain pixel,the pixel's photodiode 6111 can be exposed during an exposure period, acharge accumulated on the pixel's photodiode 6111 during the exposureperiod can be transferred to the storage area 6029 at a transfer time,and a signal can be read out from storage area 6029 at a readout time.The read out signal can correspond to a charge stored at the chargestorage area 6029. In some instances the transfer time and readout timecan be simultaneous. In other instances the transfer time and thereadout time can be sequential with the readout time occurring after thetransfer time. It was determined in the development of array 1033 thatwhere readout is sequential to transfer and without the presence ofopaque shield 6030, light incident on charge storage area 6029 duringthe delay between transfer and readout would potentially cause a signalreadout from a charge storage area 6029 to be non-representative oflight incident on one or more pixel subject to readout.

For initiation of exposure of photodiode 6111 of pixel P_(x,y) relativeto the example of FIG. 7, transfer transistor 6011 and reset transistor6022 can be turned on and off in a manner so that they have simultaneouson times. For termination of exposure of pixel P_(x,y) transfertransistor 6011 can be turned on and off. Turning on transfer transistor6011 can terminate exposure and transfer charge accumulated atphotodiode 6111 to charge storage area 6029. For readout of the chargestored at storage area 6029 select transistor 6024 can be turned on. Ifselect transistor 6024 is on at the time transfer transistor 6011 isturned on for transfer, transfer and readout can be simultaneous. Thetransfer of charges from more than one photodiode e.g., photodiode 6111and photodiode 6113 simultaneously can result in an aggregate chargebeing stored at charge storage area 6029. The aggregate charge can beregarded as a binned pixel value. A charge stored at charge storage area6029 can be responsive to light incident on one or more pixel of imagesensor array 1033. A binned pixel value can be defined when the chargestored at charge storage area 6029 is responsive to light incident onmore than one pixel of image sensor array, e.g., 2 pixels, 3 pixels, 4pixels, and so on. A binned pixel value can represent light not at thespatial area of a single pixel but a spatial area defined by anarrangement of adjacent pixels e.g., pixel P_(x,y), P_(x, y+1). Anarrangement of adjacent pixels subject to simultaneous charge transferfor binning can also be regarded as binned pixels. An arrangement ofadjacent pixels subject to simultaneous charge transfer for binning canbe regarded as a superpixel. An aggregate charge stored at a commoncharge storage area 6029 of image sensor array 1033 can comprise theaggregate charge of two or more, i.e., at least first and second pixels.In one example an aggregate charge stored at a common charge storagearea can comprise the aggregate charge of 2 pixels; in another example 3pixels, in another example 4 pixels, and so on.

Global shutter 6028 including charge storage area 6029 and shield 6030can facilitate global shutter operation. An image sensor array 1033having one or more global shutter 6028 can be capable of global shutteroperation. For global shutter operation in one embodiment pixels of eachrow of pixels of image sensor array 1033 subject to readout can havecommon exposure initiation and termination times. Rows of pixels subjectto readout for readout of a frame can include a first set of rowsdefining a first row of cells and a second set of rows defining a secondrow of cell. Further for global shutter operation, at the commonexposure termination times, charges stored at pixel photodiodes of imagesensor array 1033 subject to readout can be transferred to a globalshutter charge storage area 6029 shared by a plurality of pixels.Further for global shutter operation global shutter shield 6030 canrestrict unwanted charge buildup at a charge storage area 6029attributable to light rays being incident on charge storage area 6029prior to readout of image data representative of light incident on apixel or an arrangement of adjacent pixels of array 1033. For globalshutter operation read out of image data from various global shuttercharge storage areas 6029 of image sensor array can be sequential, withshield 6030 of the various charge storage areas storing charges forreadout restricting charge buildup attributable to light rays incidenton charge storage areas so that read out pixel values are representativeof light incident on a pixel or set of pixels of image sensor array.Image sensor array 1033 can include global shutter circuitry, the globalshutter circuitry including one or more global shutter 6028.

Apparatus 1000 can include a plurality of alternative configurations,including (a) a rolling reset configuration, (b) a 2×2 binning globalshutter configuration, (c) a 2×2 binning rolling reset configuration,(d) a 1×2 binning global shutter interlacing configuration, (e) a 1×2binning rolling reset configuration and (f) a 1×4 binning global shutterconfiguration. Additional configurations of apparatus 1000 can includeone or more of configurations (b) though (f) with different bin sizedesignators.

According to (a) a rolling reset configuration, exposure of pixels ofalternating rows of image sensor array 1033 can be initiatedsequentially and pixel values making up a frame of image data can beread out with full pixel resolution (a number of pixel values read outcan equal a number of pixels of the image sensor array 1033 addressedfor readout).

According to (b) a 2×2 binning global shutter configuration, exposure ofpixels of alternating rows of cells and in one embodiment each row ofpixels of image sensor array 1033 can be initiated simultaneously andimage data pixel values making up a frame of image data can be read outwith reduced resolution in both the X (pixel position row) and Y (pixelposition column) dimensions, with a pixel value being read out for eachof several 2×2 bins of adjacent pixels. Where pixels are binned, imagesignals of the various pixels of the bin are aggregated (e.g., summed oraveraged) so that during readout of a frame a single pixel value is readout for the bin. In a 2×2 binning global shutter configuration, exposureof pixels of different rows of a cell (and row of pixels of array 1033)can be initiated simultaneously.

According to (c) a 2×2 binning rolling reset configuration, exposure ofpixels of alternating rows of cells of image sensor array 1033 can beinitiated sequentially and pixel values making up a frame of image datacan be read out with reduced resolution in both the X (pixel positionrow) and Y (pixel position column) dimensions, with a pixel value beingread out for each of several 2×2 bins of adjacent pixels.

According to (d) a 1×2 binning global shutter interlacing configuration,exposure of pixels of alternating rows of cells and in one embodimenteach row of cells of image sensor array 1033 can be initiatedsimultaneously and pixel values making up a frame of image data can beread out with reduced resolution in the Y (pixel position column)dimension with no reduction in resolution in the X dimension, with apixel value being read out for each of several 1×2 bins of adjacentpixels. In a 1×2 binning global shutter interlacing configuration,exposure of pixels of different rows of a cell (and of array 1033) canbe initiated simultaneously.

According to (e) a 1×2 binning rolling reset configuration, exposure ofpixels of alternating rows of cells of image sensor array 1033 can beinitiated sequentially and pixel values making up a frame of image datacan be read out with reduced resolution in the Y (pixel position column)dimension with no reduction in resolution in resolution the X dimension,with a pixel value being read out for each of several 1×2 bins ofadjacent pixels.

According to (f) a 1×4 binning global shutter configuration, exposure ofpixels of a plurality of rows of cells of image sensor array 1033 and inone embodiment each row of bins of image sensor array 1033 can beinitiated simultaneously and pixel values making up a frame of imagedata can be read out with reduced resolution in the Y (pixel positioncolumn) dimension with no reduction in resolution in the X dimension,with a pixel value being read out for each of several 1×4 bins ofadjacent pixels. In a 1×4 binning global shutter configuration, exposureof pixels of different rows of a cell (and rows of pixels of array 1033)can be initiated simultaneously.

In the development of apparatus 1000, it was observed that currentlyavailable CMOS global shutter image sensor arrays consume 5 to 6transistors per pixel. Thus there is required a relatively large pixelsize for implementation with acceptable fill factor for manyapplications. For a commercially available 5 Mpx CMOS sensor, with apixel size of 1.75 um to 2.2 um, challenges exist with respect toarranging 5 to 6 transistors per pixel and still providing a pixel fillfactor yielding an acceptable signal to noise ratio (SNR).

Further description of the noted configurations is presented hereinbelow:

(a) Rolling Reset (Shutter) Configuration:

Referring FIG. 7, there are two rows of pixels: the Nth row consists ofgreen and red pixels, G and R and N+1th row consists of pixel blue andgreen pixels, B and G. Operating in accordance with a rolling resetconfiguration, timing and control circuit 1038 for controlling imagesensor array 1033 can generate the timing control as shown in FIG. 8 foroperation in accordance with the rolling reset configuration, which canbe regarded as a rolling shutter configuration.

Exposure of the Nth row 6002 can be initiated by turning on and offtransfer transistors 6011 and 6012 and reset transistors 6022 in amanner that the transfer transistors 6011 and 6012 and reset transistor6022 have simultaneous on times. Terminating exposure of a pixel e.g.,pixel P_(x,y) can be performed by turning on a pixel transfertransistor, e.g., transfer transistor 6011 to transfer chargeaccumulated at the pixel photodiode 6111 to a charge storage area e.g.,charge storage area 6029. Prior to transfer, reset transistor 6022 canbe turned on and off to remove charge from charge storage area 6029. Thepresence of shield 6030 can reduce the amount of charge buildup atcharge storage area 6029 prior to the turning on and off of resettransistor 6022 for charge transfer. Exposure of pixels of the Nth rowcan be terminated sequentially. In the example explained with referenceto the timing diagram of FIG. 8, select transistor 6024 controllingreadout can be activated simultaneously with the activation of atransfer transistor for transferring charge to storage area 6029.Accordingly, readout can be simultaneous with charge transfer.

As indicated by the timing diagram of FIG. 8, exposure and readout ofpixels of row N+1 can be sequential to the exposure and readout ofpixels of row N. Exposure transfer and readout can be performed over alarger area of the array 1033 in the manner depicted for the cell 6000shown in FIG. 7 with reference to the timing diagram of FIG. 8. In arolling reset configuration (rolling shutter configuration) each pixelsubject to readout can be subject to exposure termination at the time ofreadout.

(b) 2×2 Binning Global Shutter Configuration:

Referring FIG. 7, four pixels belong to a 2×2 cell 6000 which consistsof pixels P_(x,y), P_(x+1, y), P_(x, y+1), and P_(x+1, y+1). Timing andcontrol circuit 1038, operating according to the 2×2 binning globalshutter configuration can generate the timing control as shown in FIG. 9to perform the 2×2 binning global shutter configuration.

For operating in a binning rolling reset configuration, exposure of eachpixel of a cell subject for readout and each cell of an array 1033subject to readout can be initiated and terminated simultaneously. Forsimultaneous exposure initiation of pixels P_(x,y), P_(x+1, y),P_(x, y+1), and P_(x+1, y+1) transfer transistors 6011, 6012, 6013 and6014 and reset transistor 6022 can be turned on and off in a manner sothat they have simultaneously on periods as is indicated by the timingdiagram of FIG. 9. For simultaneous exposure termination of pixelsP_(x,y), P_(x+, y), P_(x, y+1), and P_(x+1, y+1) and transfer of chargefrom respective photodiode 6111, 6112, 6113, 6114 to charge storage area6029 transfer transistors 6011, 6012, 6013 and 6014 and can be turned onsimultaneously subsequent to a turning on and off of reset transistor6022 for clearing charge from charge storage area 6029. Because chargesfrom multiple pixels can be transferred simultaneously, a resultingcharge at charge storage area 6029 can be an aggregate charge thatdefines a binned pixel value indicative of light over the spatial areadelimited by the combination of pixels P_(x,y), P_(x+1, y), P_(x, y+1),and P_(x+1, y+1).

Exposure transfer and readout can be performed over a larger area of thearray 1033 in the manner depicted for the cell 6000 shown in FIG. 7 withreference to the timing diagram of FIG. 9. In a 2×2 binning globalshutter configuration each cell (and each pixel of each cell) subject toreadout can be subject to simultaneous exposure initiation andsimultaneous exposure termination so that each pixel of image sensorarray 1033 subject to readout has a common exposure period). Readout ofpixel values P_(x+1, y+1) can be sequential. While a 2×2 “bin” of pixelsis specifically described, image sensor array 1033 can be configured sothat bins can be provided in alternative dimensions, e.g., M×N, M≧1,N≧1, wherein at least one of M≧2 or N≧2 in accordance with a binningglobal shutter configuration. In the timing diagram of FIG. 9, readoutof an image signal from charge storage area 6029 is depicted as beingsimultaneous with charge transfer as is indicated by the selecttransistor 6024 being on at the time of charge transfer. However, itwill be understood that for other cells of an image sensor array 1033readout may not be simultaneous with charge transfer. For another cellof image sensor array 1033 select transistor 6024 can be turned on atthe period indicated by dashed in period 6032, with all other timingbeing the same as depicted in FIG. 9. During the delay between transferof charge to a charge storage area 6029 constructed in the manner chargestorage area 6029 and the readout of a signal from the charge storagearea a shield constructed in the manner of shield 6030 can be preventinglight from being incident on the charge storage area thus reducing abuildup of charge on the charge storage area 6029.

In the 2×2 binning global shutter configuration, pixels of image sensorarray 1033 subject to readout can be subject to simultaneous exposureinitiation and termination, with pixel values being read out defined byaggregate charges from multiple pixels. When exposure of all pixels ofimage sensor array 1033 subject to readout is initiated and terminatedsimultaneously, an overall frame exposure time is reduced, rendering acaptured frame less likely to include motion blur defect. With shorteroverall frame exposure time an illumination on time for illuminationassembly 800 where apparatus includes illumination assembly 800 can bereduced, reducing power consumption.

There is set forth herein with reference to FIG. 7 an apparatuscomprising an image sensor array 1033 having a first arrangement ofadjacent pixels (location A) including a first pixel P_(x,y) and asecond pixel P_(x,y+1), the first pixel and the second pixel of thefirst set of adjacent pixels sharing a first common global shutter 6028having a first charge storage area 6029, wherein the image sensor array1033 has a second arrangement of adjacent pixels (location B) includinga first pixel P_(x,y) and a second pixel P_(x,y+1), the first pixel andthe second pixel of the second set of adjacent pixels sharing a secondglobal shutter 6028 having a second common charge storage area 6029,wherein the first pixel and the second pixel of the first arrangement ofadjacent pixels (location A) are disposed in first and second rows ofthe image sensor array respectively, and wherein the first pixel and thesecond pixel of the second arrangement of adjacent pixels (location B)are disposed in third and fourth rows of the image sensor arrayrespectively, wherein the image sensor array is controlled so that eachof the first pixel and the second pixel of the first arrangement ofadjacent pixels (location A) and each of the first pixel and the secondpixel of the second arrangement of adjacent pixels (location B) havecommon exposure initiation and termination times, wherein the imagesensor array 1033 is further controlled so that readout of an imagesignal corresponding to a charge stored on the second common chargestorage area 6029 (location B) is performed sequentially relative toreadout of an image signal stored on the first common charge storagearea 6029 (location A).

(c) 2×2 Binning Rolling Reset Configuration:

In a 2×2 binning rolling reset configuration operation of image sensorarray 1033 can be in the manner of the 2×2 binning global shutterconfiguration except that instead of cells subject to readout beingsubject to simultaneous exposure initiation and termination, andsequential readout, cells subject to readout can be subject tosequential exposure initiation, sequential exposure termination (bycharge transfer) and sequential readout. While a 2×2 “bin” of pixels isspecifically described, image sensor array 1033 can be configured sothat bins can be provided in alternative dimensions, e.g., M×N, M≧1,N≧1, wherein at least one of M≧2 or N≧2 in accordance with a binningrolling reset configuration.

(d) 1×2 Binning Global Shutter Interlacing Configuration:

Referring to FIG. 7, under one exemplary control, four pixels P_(x,y),P_(x+1, y), P_(x, y+1), and P_(x+1, y+1) belong to a 2×2 cell of pixelswhich share a common global shutter 6028 having a charge storage area6029 and an opaque shield. For operating in accordance with a 1×2binning global shutter interlacing configuration, timing and controlcircuit 1038 can generate the timing control as shown in FIG. 10. Whilea 1×2 “bin” of pixels is specifically described, image sensor array 1033can be configured so that bins can be provided in alternativedimensions, e.g., 1×N, N≧2 in accordance with a binning global shutterinterlacing configuration.

For operation in accordance with a 1×2 binning global shutterinterlacing configuration with reference to cell 6000, left side pixelsP_(x,y), P_(x, y+1) can be subject to simultaneous exposure initiationand termination (by charge transfer) and readout and subsequentlythereto right side pixels P_(x+1, y), P_(x+1, y+1) can be subject tosimultaneously exposure initiation and exposure termination (by chargetransfer) and readout.

For simultaneously initiating exposure of left pixels, transfertransistors 6011, 6013 and reset transistor 6022 can be turned on andoff in a manner as to have simultaneous on times. For simultaneouslyterminating exposure of left pixels P_(x,y), P_(x, y+1) transfertransistors 6011, 6013 can be simultaneously turned on and offsubsequent to a turning on and off of reset transistor 6022 for clearingcharge from charge storage area 6029. As charges from photodiode 6111and photodiode 6113 will thus be transferred simultaneously, theircharges will be aggregated to define a binned pixel value representativeof light over the spatial area delimited by the combination of pixelP_(x,y) and pixel P_(x, y+1). For simultaneously initiating exposure ofright pixels P_(x+1, y), P_(x+1, y+1) transfer transistors 6012, 6014and reset transistor 6022 can be turned on and off in a manner so thatthey have simultaneous on periods. For simultaneously terminatingexposure of left pixels P_(x,y), P_(x, y+1) transfer transistors 6012,6014 can be turned on and off subsequent to a turning off of resettransistor 6022 for clearing charge from charge storage areas area 6029.The charges from photodiode 6112 and photodiode 6114 being transferredsimultaneously their charges will be aggregated to define a binned pixelvalue representing light over the spatial area delimited by thecombination of pixel P_(x,+1, y) and pixel P_(x,+1, y+1).

Exposure transfer and readout can be performed over a larger area of thearray 1033 in the manner depicted for the cell 6000 shown in thetransistor view portion of FIG. 7 with reference to the timing diagramof FIG. 10. In a 1×2 binning global shutter interlacing configuration,left pixels of each cell (and each pixel of each cell) subject toreadout can be subject to simultaneous exposure initiation andtermination so that each left pixel of each 2×2 cell of image sensorarray 1033 subject to readout has a common exposure period. Each cell(and each pixel of each cell) subject to readout can be subject tosimultaneous exposure initiation and termination so that each left pixelof each 2×2 cell of image sensor array 1033 subject to readout has acommon exposure period. The right pixel common exposure period (asindicated by the time between transfer transistor active periods) can besequential to the left pixel common exposure period as depicted in thetiming diagram of FIG. 10.

While left side cell pixels of array 1033 subject to readout can havecommon exposure periods, readout of exposed left side cell pixels can besequential. Similarly while right side cell pixels of array 1033 subjectto readout can have common exposure periods, readout of exposed rightside cell pixels can be sequential.

In the timing diagram of FIG. 10, readout of an image signal from chargestorage area 6029 is depicted as being simultaneous with charge transferas is indicated by the select transistor 6024 being on at the time ofcharge transfer. However, it will be understood that for other cells ofan image sensor array 1033 readout may not be simultaneous with chargetransfer. For another cell of image sensor array 1033, select transistor6024 can be turned on at the period indicated by dashed in period 6042,6044 for readout of a cell left bin and right bin respectively with allother timing being the same as depicted in the timing diagram of FIG.10. During the delay between transfer of charge to charge storage areaconstructed in the manner charge storage area 6029 and the readout of asignal from the charge storage area 6029 a shield constructed in themanner of shield 6030 can be preventing light from being incident on thecharge storage area thus reducing a buildup of charge on the chargestorage area and maintaining the characteristic of a read out imagesignal as being representative of light incident on a bin of adjacentpixels during a preceding exposure period.

In the development of image sensor array 1033 it was determined thatreading out binned pixel values representative of light over 1×N, N>=2pixels can increase a likelihood of decoding a decodable indiciaparticularly where provided by a 1D bar code symbol having bars imagedin alignment to columns of the array 1033. A 1×N bin does not have anyloss of pixel resolution in the x dimension, the critical dimension forone dimensional symbology (1 D) decoding, and the lower resolution inthe y dimension can increase a detection of a vertically elongated baror space.

(e) 1×2 Binning Rolling Reset Configuration:

Operation in a 1×2 binning rolling reset configuration can be in themanner of a 1×2 global shutter interlacing configuration except thatinstead of cells subject to readout being subject to simultaneousexposure initiation and termination, and sequential readout, cellssubject to readout can be subject to sequential exposure initiation,sequential exposure termination (by charge transfer) and sequentialreadout. While a 1×2 “bin” of pixels is specifically described, imagesensor array 1033 can be configured so that bins can be provided inalternative dimensions, e.g., 1×N, N≧2 in accordance with a binningrolling reset configuration.

(f) 1×4 Binning Global Shutter Configuration:

With reference to the 1×2 binning global shutter interlacingconfiguration, it was described that pixels of an image sensor array1033 can be exposed during successive global left cell pixel exposureperiods and a right cell pixel exposure period, with cell left sidepixels having a first common exposure period which can be regarded as aglobal exposure period and a cell right side pixels having a secondcommon exposure period that can be regarded as a global exposure period.

With minor circuit modification, image sensor array 1033 can be providedin one embodiment so that all pixels of image sensor array 1033 subjectto readout can have a common (global) exposure period with charges ofpixels being aggregated to define binned pixel values indicative oflight on a 1×4 pixel area.

In the embodiment of FIG. 11, additional transfer transistors namelytransistors 7052, 7054, 8051, 8053 are added for each four (2×2) pixelcell of array 1033 to provide 1×4 binning global shutter configurationas shown in FIG. 11. In the specific example of FIG. 11, there isprovided a circuit arrangement yielding 1×4 binning Depending on timingcontrol, adjacent groups of pixels that share a common storage area 6029can be a 2×2 group of pixels (by control according to configurations(a), (b), (c), (d), (e) or a 1×4 group of pixels (by control accordingto the control described herein below). Accordingly, sets of pixelsshown in FIG. 11 depending on timing control can define a 2×2 cell and a1×4 cell. By deletion of transfer transistors, the circuit of FIG. 11can be modified so that sharing of a global shutter 7028 having a chargestorage area 7029 and opaque shield 7030 can be on a 1×4 basis but not a2×2 basis so that the circuit defines a distribution of 1×4 pixel cellsbut not also a distribution of 2×2 pixel cells as in the embodiment ofFIG. 11. While a 1×4 “bin” of pixels is specifically described, imagesensor array 1033 can be configured so that bins can be provided inalternative dimensions, e.g., 1×N, N≧2 in accordance with a binningglobal shutter configuration, e.g. N=2, N=3, N=4, N=5, N=10 and so on.In one embodiment as shown in FIG. 11, 2×2 cell 6000 as described inconnection with the transistor view section of FIG. 7 is defined by theset of pixels P_(j, k), P_(j+1, k), P_(j, k+1), P_(j+1, k+1), and alsoby the set of pixels P_(j,k+2), P_(j+1, k+2), P_(j, k+1), P_(j, k+3),P_(j+1, k+3). A 1×4 cell of pixels is defined by set of pixels P_(j, k),P_(j, k+1), P_(j, k+2), P_(j, k+3) and also by the set of pixelsP_(j+1, k), P_(j+1, k+2), P_(j+1, k+3).

Referring to FIG. 11, there is shown a segment of an image sensor array1033 having eight pixels, namely pixels P_(j, k), P_(j+1, k),P_(j, k+1), P_(j+1, k+1), and pixels P_(j,k+2), P_(j+1, k+2),P_(j, k+1), P_(j, k+3), P_(j+1, k+3). The pixels define rows and columnsof pixels that can extend through the active area of image sensor array1033. The segment of FIG. 11 includes a global shutter 7028 havingcharge storage area 7029 and global shutter 8028 having a charge storagearea 8029, each of global shutter 7028 and global shutter 8028 having anassociated opaque shield 7030, 8030 for reducing a charge build up onstorage areas 7029, 8029, respectively attributable to light rays beingincident of array 1033. Charge storage area 7029 can be provided as partof an amplifier circuit 7020 which includes charge storage area 7029provided by a floating diffusion, reset transistor 7022, selecttransistor 7024 and detection transistor 7026. Charge storage area 8029can be provided as part of an amplifier circuit 8020 which includescharge storage area 8029 provided by a floating diffusion, resettransistor 8022, select transistor 8024, and detection transistor 8026.

Timing and control circuit 1038 can generate the timing control as shownin FIG. 12 to provide operation in a 1×4 binning global shutterconfiguration.

Referring to the timing diagram of FIG. 12, each pixel shown in FIG. 11can be subject to simultaneous exposure initiation by turning on and offof the indicated transfer and reset transistors in the manner indicated.Each pixel shown in FIG. 11 can be subject to simultaneous exposuretermination and charge transfer by turning on and off the indicatedtransfer transistors. The turning on and off of the indicated transfertransistors can be subsequent to a turning on and off of the indicatedreset transistors to clear accumulated charges therefrom, the presenceof shields 7030, 8030 reducing such charges.

For simultaneous exposure termination and charge transfer referring tothe timing diagram of FIG. 12 the turning on and off of transfer andreset transistors can be coordinated so that charges from left sidepixel photodiodes are transferred to charge storage area 7029 andfurther so that charges from right side pixel photodiodes aretransferred to charge storage area 8029. The transfer of charges of leftside photodiodes 7111, 7113, 8111, 8113 to charge storage area 7029being simultaneous, the charges will be aggregated to define a binnedpixel value indicative of light incident on the spatial area delimitedby the set of pixels P_(j,k), P_(j, k+1), P_(j, k+2) P_(j, k+3). Thetransfer of charges of right side photodiodes 7012, 7014, 8012, 8014 tocharge storage area 8029 being simultaneous the charges will beaggregated to define a binned pixel value indicative of light incidenton the spatial area delimited by the set of pixels P_(j+1, k),P_(j+1, k+1), P_(j+1, k+2), P_(j+1, k+3). Further referring to thetiming diagram of FIG. 12 readout of signals from charge storage area7029 and charge storage area 8029 can be sequential. Namely, selecttransistor 7024 can be turned on and off to read out a signalcorresponding to the binned pixel value charge stored at charge storagearea 7029 and then select transistor 8024 can be subsequently turned onand off to read out a signal corresponding to the binned pixel valuecharge stored at charge storage area 8029. During the delay between thereadouts of signals from charge storage area 7029 and charge storagearea 8029, opaque shield 8030 can be blocking light rays from beingincident of charge storage area 8029 thereby reducing unwanted chargebuildup on charge storage area 8029.

Exposure transfer and readout can be performed over a larger area of thearray 1033 in the manner depicted for the set of pixels shown in FIG. 11with reference to the timing diagram of FIG. 12. In a 1×4 binning globalshutter configuration each cell (and each pixel of each cell) subject toreadout can be subject to simultaneous exposure initiation andtermination so that each pixel of image sensor array 1033 subject toreadout has a common exposure period that can be regarded as a globalexposure period. Readout of exposed pixels can be sequential however. Inthe timing diagram of FIG. 12 readout of image signal from chargestorage area 7029 is depicted as being simultaneous with charge transferas is indicated by the select transistor being on at the time of chargetransfer. However, it will be understood that for other charge storageareas of an image sensor array 1033 readout may not be simultaneous withcharge transfer. For example readout of pixel value in the form of ananalog signal from charge storage area 8029 is not simultaneous withcharge transfer. During the delay between transfer of charge to chargestorage area constructed in the manner charge storage area 8029 and thereadout of a signal from the charge storage area 8029 shield 8030 can bepreventing light from being incident on the charge storage area 8029thus reducing a buildup of charge on the charge storage area 8029.Referring to exploded view section of FIG. 11, 1×4 cells constructedaccording to cell 7000 can be distributed throughout array 1033 todefine aligned and adjacent rows and columns of 1×4 cells 7000 or imagesensor array 1033, the aligned adjacent 1×4 cells 7000 defining rowse.g., rows 7221, 7222, 7223 and columns e.g., columns 7325, 7326, 7327of pixels.

All the above configurations (a) through (f) can be performed withwindowing operation so that there can be provided binning with windowingwith a single frame readout. Windowing can be accomplished byselectively addressing for readout of binned or unbinned pixel valuesfrom less than a maximum number of pixels at one or more localized pixelcoordinate areas of image sensor array 1033. An example of a window is acenter J (J≧1) rows of pixels of image sensor array 1033, where J is thenumber of rows of image sensor array 1033.

In one embodiment, configurations as set forth herein are “fixed”configurations. That is, apparatus 1000 can be manufactured and providedto an end user so that the function of the apparatus 1000 does not varyfrom the function of a particular configuration e.g., one ofconfigurations (a) (b) (c) (d) (e) or (f) in the lifetime of theapparatus 1000.

In another embodiment, the configurations set forth herein are dynamicconfigurations capable of change during the lifetime of the apparatus1000 responsively to an operator input control. Image sensor 1032 canhave appropriate switching circuitry 1031 as indicated in FIG. 2 forperforming the noted switching functionality and image sensor array 1033can be configured so that each of the configurations (a) (b) (c) (d) (e)and (f) can be activated by apparatus 1000. In one example, a userinterface display 1222 can display various buttons 6102, 6104, 6106,6108, 6110, 6112 as shown in FIG. 1 corresponding to variousconfigurations allowing an operator to actuate one configuration out ofa plurality of configurations. Apparatus 1000 can also be adapted sothat an operator can input an alternative operator input control forselection of a configuration. The alternative operator input control canbe e.g., one or more of a serial command transmitted from a computerexternal to apparatus 1000 and received by communication interface 1050of apparatus 1000 or a reading of a programming bar code symbol. Theconfigurations (a), (b), (c), (d), (e), and (f) set forth herein are setforth as being configurations of imaging apparatus 1000. As specificoperations of image sensor array 1033 correspond to each configuration,the configurations (a), (b), (c), (d), (e), and (f) can be regarded asconfigurations of image sensor array 1033, image sensor 1032 and imagesensor integrated circuit 1040. In one embodiment, apparatus 1000 can beoperative so that apparatus 1000 remains in a currently activeconfiguration for a duration of a trigger signal activation period (theon time of trigger signal 5002) as set forth with reference to thetiming diagram of FIG. 6.

Apparatus 1000 can also be adapted to capture one or more frame betweentrigger signal activation periods, and can process the one or more framefor sensing of one or more sensed condition.

In one embodiment an operator can activate a certain one of a pluralityof configurations in a manner that is dependent on an expected operatingenvironment of apparatus 1000. Document reading is a process where astandard sized document, e.g., A4 paper, business card, is subject toimage capture for archiving purposes. In the development of apparatus1000, it was determined that for document reading frame pixel resolutionis often an important factor in determining a quality of a framerepresenting a standard size document. Standard size documents commonlyinclude fine grain print or other details not rendered appropriatelyabsent highest pixel resolution. Accordingly, in the development ofapparatus 1000 it was determined that it can be useful for an operatorto input an operator input control to activate configuration (a) rollingreset configuration, yielding a highest possible pixel resolution foruse of apparatus 1000 in performance of document reading.

In the development of apparatus 1000 it was determined that motiontolerance is an important factor in determining success and speed ofdecoding for decodable indicia. Configurations set forth herein such asconfigurations (b) (d) and (f) that facilitates global shutter operationcan provide improved motion tolerance and accordingly improved decodingsuccess rate and speed. Configurations herein facilitating globalshutter operation facilitate improved motion tolerance for the reasonthat with shorter exposure times resulting from global shutteroperation, movement of apparatus 1000 or target T (FIG. 2) duringexposure is less likely to result in image blur of a captured frame.Accordingly, in use of apparatus 1000, an operator can input an operatorinput control to activate a configuration facilitating global shutteroperation for use of the apparatus for indicia decoding.

By the providing of both a rolling reset configuration and aconfiguration in which global shutter operation is facilitated there isset forth herein in one embodiment an imaging apparatus comprising animage sensor array, an imaging lens assembly for focusing an image ontothe image sensor array wherein the imaging apparatus includes a firstconfiguration in which one or more frame is read out of the image sensorarray in accordance with a rolling shutter operation in which exposureof pixels of first and second rows of pixels of the image sensor arrayis initiated sequentially, and wherein pixel values responsive to lightincident on pixels of the first and second rows of pixels subject toreadout are un-binned pixel values that represent light incident on aspatial area delimited by a single pixel of the image sensor array, andwherein the imaging apparatus includes a second configuration in whichone or more frame is read out of the image sensor array in accordancewith a global shutter operation in which exposure of pixels of the firstand second rows of pixels of the image sensor array is initiated andterminated simultaneously, and wherein pixel values responsive to lightincident on pixels of the first and second rows of pixels subject toreadout are binned pixel values read out using shared global shuttercircuitry of the image sensor array that represent light incident on aspatial area delimited by an arrangement of two or more pixels of theimage sensor array.

Further, in the development of apparatus 1000 it was determined thatdifferent configurations that facilitate global shutter operation canyield a most significant improvement in decoding performance dependingon a particular reading range (imaging apparatus to target distance). Inthe development of apparatus 1000 it was determined that at relativelyclose reading range (imaging apparatus to target distance), e.g., under30 cm, a reduction of pixel resolution of a captured frame from a fullpixel resolution (one pixel value for each pixel subject to readout) isless likely to affect decoding performance. At relatively close readingrange, a decodable indicia representation is more likely to berepresented by pixel values of a larger portion of the frame.Accordingly, in the development of apparatus 1000 it was determined thatan operator can input and operator input control to apparatus 1000 foractivation of configuration facilitating global shutter operation withbinned pixel values representing light incident on an area M×N bin ofpixels, M>=2, N>=2, e.g., configuration (b) for use of the apparatus1000 for decoding at relatively close reading range, providing goodmotion tolerance and pixel resolution sufficient for facilitatingdecoding of 1D and 2D (e.g., matrix bar code symbols) at relativelyclose reading range.

Further in the development of apparatus 1000 it was determined that atrelatively longer reading ranges, e.g., greater than 5 m, a decodableindicia is likely to be represented by a smaller portion of pixel valuesof a frame and accordingly more likely to be affected by a loss inresolution. Accordingly, in the development of apparatus 1000 it wasdetermined that an operator can input an operator input control toapparatus 1000 for activation of configuration facilitating globalshutter operation with binned pixel values representing light incidenton an area 1×N bin of pixels, N>=2 for use of the apparatus 1000 fordecoding at longer reading ranges. With 1×N binning active a read outand captured frame includes full pixel resolution in the x dimension,reduced pixel resolution in the y dimension. A 1×N bin does not have anyloss of pixel resolution in the x dimension, the critical dimension for1D decoding, and the lower resolution in the y dimension can increase adetection of a vertically elongated bar or space. Accordingly,activation of a configuration facilitating global shutter operation and1×N binning can increase motion tolerance without reduction of pixelresolution in the x dimension and without reduction of decodingperformance.

In another embodiment, image sensor array 1033 can be controlled so thatconfigurations described herein are dynamic configurations that can bevaried responsively a sensed condition.

A timing diagram illustrating operation of apparatus 1000 in oneembodiment during performance of image capture operations is shown inFIG. 13. Referring to the timing diagram of FIG. 13, signal 5002 is atrigger signal which can be made active, e.g., via actuation of trigger1220, via power up apparatus 1000, via receipt of a serial command froman external computer. Signal 5102 is an illumination energization levelsignal having on and off states. Signal 5202 is an exposure controlsignal having active states defining exposure periods and inactivestates intermediate exposure periods. Exposure control signal 5202 cancontrol activation and deactivation of transfer transistors, e.g.,transfer transistor 6011 and reset transistors e.g., reset transistor6022. Signal 5302 is a readout control signal. When readout controlsignal 5302 is active, image signals can be read out of image sensorarray 1033. Further regarding the timing diagram of FIG. 13, periods5420, 5422, 5424 are periods at which CPU 1060 can process frames ofimage data, e.g., for one or more of attempting to decode for decodableindicia, de-mosaicing in the case the image data is color image data,parameter determination. Period 5220 is the exposure period forframe_(N−1), period 5320 is the readout period for frame_(N−1) andperiod 5420 is the processing period for frame_(N−1). For the succeedingframe, frame_(N), periods 5222, 5322, 5422 are the exposure, readout andprocessing periods respectively. For the next succeeding frame,frame_(N+1), periods 5224, 5324, 5424 are exposure, readout andprocessing periods respectively. Apparatus 1000 can be operative so thatprior to exposure period 5220 and after trigger signal 5002 is activatedapparatus 1000 can be capturing “parameter determination” frames thatare processed for parameter (e.g., exposure, gain) determination and insome instances, not subject to a decode attempt or other processingunrelated to parameter determination.

With reference to the timing diagram of FIG. 13 Frame=Frame_(N−1) can beread out in according with the rolling reset configuration and can havea full frame full pixel resolution with a frame picture size equal tothe picture size of the image sensor array 1033. In one example imagesensor array 1033 can be a 5 Mpx (2592×1944) image sensor array andFrame=Frame_(N−1) can have a picture size of 2592×1944 pixel values.

With further reference to the timing diagram of FIG. 13Frame=Frame_(N−1) can be read out with image sensor array 1033 operatingin accordance with a 2×2 binning global shutter configuration and canread out a full frame of reduced pixel resolution having a picture sizeof 1296×972 (quarter pixel resolution resulting from 2×2 binning).

Frame=Frame_(N+1) can be read out with image sensor array 1033 operatingin accordance with a 1×N (N=4) binning global shutter configuration,configuration (f) with windowing and can output a windowed frame ofreduced pixel resolution. In one example a window of 2592×500 center rowpixels can be exposed for read out of a reduced pixel resolutionwindowed frame having picture size (number of pixel values) of 2592×125(full pixel resolution in the x dimension, reduced pixel resolution inthe y dimension).

Frame=Frame_(N−1) having the highest resolution of Frames=Frame_(N−1),Frame_(N), Frame_(N+1) can be a frame optimized for visual quality andcan be particularly well suited for use as a digital photograph fordisplay on a display e.g., display 1222 or for archiving. Frames for usea digital photograph can include portrait type frames (personalportrait, landscape) and document reading frames, e.g., where apparatus1000 is used for document reading and archiving and/or displaying astandard size document, e.g., and A4 paper document or a business carddocument. Frames=Frame_(N), Frame_(N+1) as indicated in the timingdiagram of FIG. 13 have relatively short exposure periods andaccordingly have improved motion tolerance and each can be particularlywell suited for use as a frame for subjecting to attempts to decode fora decodable indicia during respective processing period 5422, 5424(Frame=Frame_(N−1) can also be subject to an attempt to decode duringprocessing period 5420). Frame=Frame_(N) being a full frame of reducedpixel resolution relative to a full pixel resolution frame can beespecially well suited for reading at a close imaging apparatus totarget distance where a decodable indicia such as a bar code symbolrepresentation can be expected to consume a relatively larger area of atarget substrate T (FIG. 2) that can be represented by a full frame andwhere spatial resolution can be less important for providing asuccessful decode. Frame=Frame_(N+1) being a windowed frame of reducedresolution (but with no reduction in pixel resolution in the xdimension) can be especially well suited for use in a decode attempt ata relatively longer imaging apparatus to target distance where adecodable indicia can be expected to consume a relatively smallerportion of an area that can be represented by a full frame of image dataand where spatial resolution of a frame is relatively more important fora successful decode.

In one embodiment the switching of configurations as indicated in thetiming diagram of FIG. 13 during a trigger signal activation period canbe on a closed loop basis e.g., responsive to one or more sensedcondition. In one embodiment a sensed condition can be a sensed imagingapparatus to target distance. A sensed imaging apparatus to targetdistance can be determined e.g., based on an output of one or more ofrange detection unit 1210 or based on a position and/or size of aprojected light pattern such as aiming pattern 1262 (FIG. 2) in acaptured frame of image data (in such embodiment, projection of aimingpattern 1262 can be synchronized to one or more exposure periodoccurring during a trigger signal activation period). For example,apparatus 1000 can be operative to switch to a 2×2 binning globalshutter configuration, configuration (b) on sensing of a close imagingapparatus to target distance (d=d₁) and can further be operative toswitch to a 1×4 binning global shutter configuration, configuration (f),on sensing of a long range imaging apparatus to target distance d=d₂>d₁,and can further be operative to switch to a rolling reset configuration,configuration (a), on sensing of a maximally long imaging apparatus totarget distance d=d₃>d₂. A sensing that a maximally long readingdistance, d=d₃, is present can be a determination that apparatus 1000 isbeing used to capture a portrait frame of image data in which activationof a rolling reset configuration having full pixel resolution canoptimize apparatus 1000 for performance of the use case. In one example,d₁ can be designated as distances of under 1 m, d₂ can be designated asdistances between 1 m and 30 m and d₃ can be designated as distances ofgreater than 30 m. In one embodiment, one or more sensed condition canbe determined by processing of image data e.g., image data capturedusing imaging assembly 1033 of imaging apparatus 1000. In one example asalready referenced, the processing can be processing to determine alocation and/or size of a projected light pattern projected by theapparatus 1000 for purposes of determining a reading range (imagingapparatus to target distance). In another example a processing of imagedata can be processing to determine that a decodable indicia isrepresented in a captured frame of image data. For example, apparatus1000 can be operating in rolling reset configuration, configuration (a)and a processing of a frame captured using image sensor array 1033 withthe configuration active e.g., during processing period 5420 can yield adetermination that a decodable indicia is represented in a current fieldof view of apparatus 1000. Apparatus 1000 can be operative so thatresponsively to such determination apparatus 1000 can switch operationof apparatus 1000 to a configuration that well adapts apparatus 1000 foruse in decoding of decodable indicia, e.g., a configuration facilitatingglobal shutter operation, e.g., configurations (b), (d), or (f) setforth herein. While in some embodiments, it can be useful to activateconfiguration (a) for digital photograph reading, configuration (b) forrelatively close range indicia decoding, and configuration (f) forrelatively long range indicia decoding, it will be understand that thevarious configurations can be usefully activated for alternativeapplications. For example, it can be useful to activate configurations(b) or (f) for digital photograph capture where motion tolerance is amajor concern, or activate configuration (b) for relatively long rangeindicia decoding, or activate configuration (a) for indicia decoding atrelatively close or relatively long range or activate configuration (f)for digital photograph capture or for relatively close range indiciadecoding.

While an example is set forth with reference to FIG. 13 whereinconfigurations can be switched responsively to one or more sensedcondition sensed during a trigger signal activation period, a switchingof configurations responsively to a sensed condition can in addition oralternatively occur intermediate of trigger signal activation periods.For example, between trigger signal activation periods apparatus 1000can be operative to determine a range of apparatus 1000 or other sensedcondition and responsively to the range determination or other sensedcondition can activate a certain configuration and in one embodimentapparatus 1000 can operate in accordance with the certain configurationfor a duration of a next activated trigger signal activation period. Inone embodiment, imaging apparatus 1000 can be operative so thatintermediate of trigger signal activation periods, imaging apparatus1000 utilizes image sensor array 1033 to capture one or more frame ofimage data for processing for determining a sensed condition, as setforth herein.

Further, in one embodiment with reference to the timing diagram of FIG.13 configurations of image sensor array 1033 can be switchedresponsively to a trigger signal activation on an open loop basiswithout being responsive to a sensed condition. In the example of thetiming diagram of FIG. 13 a configuration switching is depicted whereinthere is switching between configuration (a), configuration (b) andconfiguration (f). However, apparatus 1000 can be operative to performconfiguration switching according to an alternative pattern, e.g., anypossible permutation of an ordering of the configurations (a), (b) and(f). Further, apparatus 1000 can be operative so that a period of anactivated configuration is more than one frame. In the example of FIG.13, the configuration activation periods are depicted as having aduration of one frame. However, apparatus 1000 can be adapted in anotherembodiment so that one or more configurations depicted as beingactivated during a trigger signal activation period have configurationactivation periods of more than one frame.

A small sample of systems methods and apparatus that are describedherein is as follows:

A1. An apparatus comprising:

-   -   an image sensor array having a plurality of pixels including a        first pixel and a second pixel, the first pixel and the second        pixel sharing a common global shutter having a charge storage        area and an associated opaque shield, the opaque shield for        reducing charge buildup on the charge storage area attributable        to light rays being incident on the charge storage area.        A2. The apparatus of A1, wherein the image sensor array is        operative so that a charge from the first pixel is transferred        to the charge storage area and remains at the charge storage        area for a storage period prior to readout of the charge from        the charge storage area, wherein the opaque shield reduces        buildup of charge at the charge storage area during the charge        storage period so that an affect of incident light on the charge        storage area during the charge storage period is reduced.        A3. The apparatus of A2, wherein the image sensor array is        operative so that a charge from the second pixel is transferred        to the common charge storage area simultaneously with the        transfer of the charge from the first pixel, the charge storage        area storing an aggregate charge of at least the first pixel and        the second pixel.        A4. The apparatus of A3, wherein the image sensor array includes        the first pixel, the second pixel, a third pixel and a fourth        pixel shared by the charge storage area, wherein the image        sensor array is operative so that charge from the second pixel,        third pixel and fourth pixel are transferred to the charge        storage area simultaneously with the transfer of charge from the        first pixels, wherein the charge storage area has an aggregate        charge of the first pixel, second pixel, third pixel and fourth        pixel defining a binned pixel value present light over the        spatial area defined by the first pixel, second pixel, third        pixel and fourth pixel.        A5. The apparatus of any of A1 through A4, wherein the image        sensor array is operative so that charges from the first pixel        and the second pixel are subject to simultaneous transfer to the        charge storage area for storage of an aggregate charge on the        charge storage area for a storage period prior to readout of the        aggregate charge from the charge storage area, wherein the        aggregate charge defines a binned pixel value, and wherein the        opaque shield reduces buildup of charge at the charge storage        area attributable to incident light rays during the charge        storage period so that an affect of incident light on the charge        storage area during the charge storage period is reduced.        A6. The apparatus of A5, wherein the binned pixel value        represents light incident on a spatial area delimited by a 1×N,        N≧2 arrangement of adjacent pixels of the image sensor array.        A7. The apparatus of A5, wherein the binned pixel value        represents light incident on a spatial area delimited on an M×N,        M≧2, N≧2 arrangement of adjacent pixels of the image sensor        array.        A8. The apparatus of any of A1 through A7, wherein the apparatus        includes a hand held housing in which the image sensor array is        disposed.        A9. The apparatus of any of A1 through A7, wherein the apparatus        is provided by an image sensor integrated circuit.        A10. The apparatus of any of A1 through A8, wherein the        apparatus is provided by an imaging apparatus having an imaging        lens for focusing an image onto the image sensor array, the        apparatus operative to capture a frame of image data utilizing        the image sensor array.        A11. The apparatus of any of A1 through A8, wherein the        apparatus is provided by an imaging apparatus having an imaging        lens for focusing an image onto the image sensor array, the        imaging apparatus being operative to capture a frame of image        data utilizing the image sensor array and further being        operative to subject the frame of image data to an attempt to        decode a decodable indicia.        A12. The apparatus of A10 or A11, wherein the frame of image        data is a windowed frame.        A13. The apparatus of A10 or A11 wherein the frame of image data        is a windowed frame having binned pixel values.        A14. The apparatus of A10 or A11, wherein the frame of image        data is a windowed frame having binned pixel values, wherein        pixel values of the binned pixel values represent light incident        on a spatial area delimited by a 1×N, N≧2 arrangement of        adjacent pixels of the image sensor array.        A15. The apparatus of A10 or A11, wherein the apparatus is        operative so that responsively to trigger signal activation the        apparatus reads out a first frame and a second frame of image        data from the image sensor array.        A16. The apparatus of A15, wherein the second frame of image        data is read out subsequent to read out of the first frame.        A17. The apparatus of A15, wherein the first frame is a full        pixel resolution full frame and wherein the second frame of        image data has a picture size reduced relative to a picture size        corresponding to a full pixel resolution full frame.        A18. The apparatus of A15, wherein the first frame has a first        set of pixel values corresponding to a first set of pixels of        the image sensor array, wherein the second frame has a set of        pixel values corresponding to a second set of pixels of the        image sensor array, the second set of pixels being different        than the first set.        A19. The apparatus of A15, wherein the first frame has a first        set of pixel values corresponding to a first set of pixels of        the image sensor array, wherein the second frame has a set of        pixel values corresponding to a second set of pixels of the        image sensor array, the second set of pixels being different        than the first set, wherein one or more of the first set of        pixel values and second set of pixel values are binned pixel        values.        A20. The apparatus of any of A1 through A19, wherein the first        pixel and the second pixel are disposed in first and second        adjacent rows of the image sensor array, wherein the image        sensor array is operative so that the first pixel and the second        pixel have sequential exposure initiation times, wherein the        image sensor array is further operative so that the first pixel        and the second pixel have sequential readout times.        A21. The apparatus of any of A1 through A20, wherein the        apparatus includes a first configuration and a second        configuration, wherein each of the first configuration and the        second configuration are configurations in which pixels of        different rows of the image sensor array subject to readout have        common exposure initiation and termination times.        A22. The apparatus of any of A1 through A20, wherein the        apparatus includes a first configuration and a second        configuration, wherein each of the first configuration and the        second configuration are configurations in which pixels of the        image sensor array subject to readout have common exposure        initiation and termination times, wherein binned pixels values        corresponding to arrangements of adjacent pixels of a first        dimension are read out of the image sensor array when the        apparatus operates in accordance with the first configuration,        and wherein binned pixel values corresponding to arrangements of        adjacent pixels of a second dimension are read out of the image        sensor array when the apparatus operates in accordance with the        second configuration, and wherein the second dimension is        different than the first dimension.        A23. The apparatus of any of A1 through A20, wherein the        apparatus includes a first configuration and a second        configuration, wherein the first pixel and the second pixel of        the image sensor array when subject to readout with the first        configuration active do not have common exposure initiation and        termination times, and wherein the first pixel and second pixel        of the image sensor array when subject to readout with the        second configuration active do have common exposure initiation        and termination times.        A24. The apparatus of any of A1 through A20, wherein the        apparatus includes a first configuration and a second        configuration, wherein apparatus is operative to switch from the        first configuration to the second configuration responsively to        a manually input control manually input to the apparatus, the        apparatus operating in accordance with a selected configuration        for a duration of a trigger signal activation period activated        subsequent to a selection of a selected configuration.        A25. The apparatus of any of A1 through A20, wherein the        apparatus has a first configuration in which pixel values read        out from the image sensor array are devoid of binned pixel        values corresponding to bins of pixels of the image sensor        array, and a second configuration in which pixel values read out        from the image sensor array include binned pixel values        corresponding to bins of pixels, wherein the apparatus is        operative to switch between the first configuration and the        second configuration responsively to one or more of a sensed        condition and an operator input control.        A26. The apparatus of any of A1 through A25, wherein the image        sensor array includes a plurality of cells, each cell having a        set of components constructed in accordance with the first pixel        the second pixel the common storage area and the shield so that        each cell has a first pixel a second pixel a common storage area        and an opaque shield.        A27. The apparatus of any of A1 through A25, wherein the image        sensor array includes first and second cells, each cell of the        first and second cells having a set of components constructed in        accordance with the first pixel the second pixel, the common        storage area and the shield so that each of the first cell and        the second cell has a first pixel a second pixel a common        storage area and an opaque shield, wherein the image sensor        array is operative so that there is a common exposure initiation        time for exposure of the first and second pixels of the first        cell and for the first and second pixels of the second cell, the        image sensor array further being operative so that transfer of        charge from the first pixel to the charge storage area of the        first cell and transfer of charge from the first pixel to the        charge storage area of the second cell is performed        simultaneously, the image sensor array further being operative        so that readout of charge from the charge storage area of second        cell is initiated sequentially in relation to readout of charge        from the charge storage area of the first cell.        A28. The apparatus of any of A1 through A26, wherein the charge        storage area is included in a pixel amplifier circuit.        A29. The apparatus of any of A1 through A27, wherein the        apparatus is operative in accordance with a configuration        wherein exposure of pixels of successive rows of cells of the        image sensor array is initiated sequentially.        A30. The apparatus of any of A1 through A27, wherein the        apparatus is operative in accordance with a configuration,        wherein exposure of pixels of a plurality of rows of pixels the        image sensor array is initiated simultaneously.        A31. The apparatus of any of A1 through A27, wherein the        apparatus is operative in accordance with a configuration,        wherein exposure of pixels of a plurality of rows of cells of        the image sensor array is initiated simultaneously, and wherein        there is read out from the image sensor array pixel values        corresponding to bins of pixels having vertically elongated        dimensions M×N, N>M.        B1. An apparatus comprising:    -   an image sensor array having a first arrangement of adjacent        pixels including a first pixel and a second pixel, the first        pixel and the second pixel of the first arrangement of adjacent        pixels sharing a first global shutter having a first charge        storage area;    -   wherein the image sensor array has a second arrangement of        adjacent pixels including a first pixel and a second pixel, the        first pixel and the second pixel of the second arrangement of        adjacent pixels sharing a second global shutter having a second        charge storage area;    -   wherein the first pixel and the second pixel of the first        arrangement of adjacent pixels are disposed in first and second        rows of the image sensor array respectively, and wherein the        first pixel and the second pixel of the second arrangement of        adjacent pixels are disposed in third and fourth rows of the        image sensor array respectively;    -   wherein the image sensor array is operative so that each of the        first pixel and the second pixel of the first arrangement of        adjacent pixels and each of the first pixel and the second pixel        of the second arrangement of adjacent pixels have common        exposure initiation and termination times;    -   wherein the image sensor array is further operative so that        readout of an image signal corresponding to a charge stored on        the second common charge storage area is performed sequentially        relative to readout of an image signal corresponding to a charge        stored on the first common charge storage area.        B2. The apparatus of B1, wherein the second common charge        storage area comprises an associated opaque shield, the opaque        shield for reducing an amount of charge build up on the second        common charge storage area attributable to light rays being        incident on the second common charge storage area during a delay        between a termination of exposure of the first pixel and the        second pixel of the second arrangement of adjacent pixels, and        read out of an image signal corresponding to a charge stored on        the second common charge storage area.        B3. The apparatus of B2, wherein the image sensor array is        operative so that a charge from the first pixel of the second        arrangement of adjacent pixels is transferred to the common        charge storage area of the second arrangement of adjacent pixels        and remains at the common charge storage area of the second        arrangement of adjacent pixels for a storage period prior to        readout of the charge from the common charge storage area of the        second arrangement of adjacent pixels, wherein the opaque shield        reduces buildup of charge at the common charge storage area of        the second arrangement of adjacent pixels during the charge        storage period so that an affect of incident light on the common        charge storage area during the charge storage period is reduced.        B4. The apparatus of any of B1 through B3, wherein the image        sensor array is operative so that a charge from the second pixel        of the second arrangement of adjacent pixels is transferred to        the common charge storage area of the second arrangement of        adjacent pixels simultaneously with the transfer of the charge        from the first pixel of the second arrangement of adjacent        pixels, the common charge storage area of the second arrangement        of adjacent pixels storing an aggregate charge of at least the        first pixel and the second pixel.        B5. The apparatus of B4, wherein the second arrangement of        adjacent pixels includes the first pixel, the second pixel, a        third pixel and a fourth pixel shared by the common charge        storage area of the second arrangement of adjacent pixels,        wherein the image sensor array is operative so that charge from        the second pixel, third pixel and fourth pixel of the second        arrangement of adjacent pixels are transferred simultaneously        with the transfer of charge from the first pixel of the second        arrangement of adjacent pixels, wherein the common charge        storage area of the second arrangement of adjacent pixels stores        an aggregate charge of the first pixel, second pixel, third        pixel and fourth pixel defining a binned pixel value        representing light over the spatial area defined by the first        pixel, second pixel, third pixel and fourth pixel of the second        arrangement of adjacent pixels.        B6. The apparatus of any of B1 through B4, wherein the image        sensor array is operative so that charges from the first pixel        and the second pixel of the second arrangement of adjacent        pixels are subject to simultaneous transfer to the common charge        storage area of the second arrangement of adjacent pixels for        storage of an aggregate charge on the common charge storage area        of the second arrangement of adjacent pixels for a storage        period prior to readout of the aggregate charge from the common        charge storage area of the second arrangement of adjacent        pixels, wherein the aggregate charge defines a binned pixel        value, and wherein the opaque shield reduces buildup of charge        at the common charge storage area attributable to incident light        rays during the charge storage period so that an affect of        incident light on the common charge storage area during the        charge storage period is reduced.        B7. The apparatus of B6, wherein the binned pixel value        represents light incident on a spatial area delimited by a 1×N,        N≧2 arrangement of adjacent pixels of the image sensor array.        B8. The apparatus of B6, wherein the binned pixel value        represents light incident on a spatial area delimited on an M×N,        M≧2, N≧2 arrangement of adjacent pixels of the image sensor        array.        B9. The apparatus of any of B1 through B8, wherein the apparatus        includes a hand held housing in which the image sensor array is        disposed.        B10. The apparatus of any of B1 through B9, wherein the        apparatus is provided by an image sensor integrated circuit.        B11. The apparatus of any of B1 through B9, wherein the        apparatus is provided by an imaging apparatus having an imaging        lens for focusing an image onto the image sensor array, the        apparatus operative to capture a frame of image data utilizing        the image sensor array.        B12. The apparatus of any of B1 through B9, wherein the        apparatus is provided by an imaging apparatus having an imaging        lens for focusing an image onto the image sensor array, the        imaging apparatus being operative to capture a frame of image        data utilizing the image sensor array and further being        operative to subject the frame of image data to an attempt to        decode a decodable indicia.        B13. The apparatus of B11 or B12, wherein the frame of image        data is a windowed frame.        B14. The apparatus of B11 or B12, wherein the frame of image        data is a windowed frame having binned pixel values.        B15. The apparatus of B11 or B12, wherein the frame of image        data is a windowed frame having binned pixel values, wherein        pixel values of the binned pixel values represent light incident        on a spatial area delimited by a 1×N, N≧2 arrangement of        adjacent pixels of the image sensor array.        B16. The apparatus of any of B11 or B12, wherein the apparatus        is operative so that responsively to trigger signal activation        the apparatus reads out a first frame and a second frame of        image data from the image sensor array.        B17. The apparatus of B16, wherein the second frame of image        data is read out subsequent to read out of the first frame.        B18. The apparatus of B16, wherein the first frame is a full        pixel resolution full frame and wherein the second frame of        image data has a picture size reduced relative to a picture size        corresponding to a full pixel resolution full frame.        B19. The apparatus of B16, wherein the first frame has a first        set of pixel values corresponding to a first set of pixels of        the image sensor array, wherein the second frame has a set of        pixel values corresponding to a second set of pixels of the        image sensor array, the second set of pixels being different        than the first set.        B20. The apparatus of B16, wherein the first frame has a first        set of pixel values corresponding to a first set of pixels of        the image sensor array, wherein the second frame has a set of        pixel values corresponding to a second set of pixels of the        image sensor array, the second set of pixels being different        than the first set, wherein one or more of the first set of        pixel values and second set of pixel values are binned pixel        values.        B21. The apparatus of any of B1 through B20, wherein the        apparatus includes a first configuration and a second        configuration, wherein each of the first configuration and the        second configurations are configurations in which pixels of        different rows of the image sensor array subject to readout have        common exposure initiation and termination times.        B22. The apparatus of any of B1 through B20, wherein the        apparatus includes a first configuration and a second        configuration, wherein each of the first configuration and the        second configuration are configurations in which pixels of the        image sensor array subject to readout have common exposure        initiation and termination times, wherein binned pixels values        corresponding to pixel sets of a first dimension are read out of        the image sensor array when the apparatus operates in accordance        with the first configuration, and wherein binned pixel values        corresponding to pixel sets of a second dimension are read out        of the image sensor array when the apparatus operates in        accordance with the second configuration, and wherein the second        dimension is different than the first dimension.        B23. The apparatus of any of B1 through B20, wherein the        apparatus includes a first configuration and a second        configuration, wherein apparatus is operative to switch from the        first configuration to the second configuration responsively to        a manually input control manually input to the apparatus, the        apparatus operating in accordance with a selected configuration        for a duration of a trigger signal activation period activated        subsequent to a selection of a selected configuration.        B24. The apparatus of any of B1 through B23, wherein the common        charge storage area of the second set of adjacent pixels is        included in a pixel amplifier circuit.        B25. The apparatus of any of B1 through B23, wherein the        apparatus is operative in accordance with a configuration,        wherein exposure of pixels of a plurality of rows of cells of        the image sensor array is initiated simultaneously, and wherein        there is read out from the image sensor array pixel values        correspondingly to bins of pixels having vertically elongated        dimensions M×N, N>M.        C1. An imaging apparatus comprising:    -   an image sensor array;    -   an imaging lens assembly for focusing an image onto the image        sensor array;    -   wherein the imaging apparatus includes a first configuration in        which the imaging apparatus is operative to read out one or more        frame of image data from the image sensor array in accordance        with a rolling shutter operation in which exposure of pixels of        first and second rows of pixels of the image sensor array is        initiated sequentially, and wherein pixel values responsive to        light incident on pixels of the first and second rows of pixels        subject to readout are un-binned pixel values that represent        light incident on a spatial area delimited by a single pixel of        the image sensor array;    -   wherein the imaging apparatus includes a second configuration in        which of the imaging apparatus is operative to read out one or        more frame of image data from the image sensor array in        accordance with a global shutter operation in which exposure of        pixels of the first and second rows of pixels of the image        sensor array is initiated and terminated simultaneously, and        wherein pixel values responsive to light incident on pixels of        the first and second rows of pixels subject to readout are        binned pixel values read out using shared global shutter        circuitry of the image sensor array that represent light        incident on a spatial area delimited by an arrangement of two or        more pixels of the image sensor array.        C2. The imaging apparatus of C1, wherein the imaging apparatus        includes a hand held housing in which the image sensor array is        disposed.        C3. The imaging apparatus of C1, wherein the imaging apparatus        is adapted for fixed mounting.        C4. The imaging apparatus of any of C1 through C3, wherein the        imaging apparatus is operative so that the first configuration        and the second configuration can be activated responsively to an        operator input control.        C5. The imaging apparatus of any of C1 through C3, wherein the        imaging apparatus is operative to sequentially activate the        first configuration and the second configuration on an open loop        basis responsively to a trigger signal activation.        C6. The imaging apparatus of C5, wherein the imaging apparatus        is operative to sequentially activate the first configuration        and the second configuration by activating the second        configuration prior to activating the first configuration.        C7. The imaging apparatus of any of C1 through C6, wherein the        imaging apparatus is operative to activate one or more of the        first configuration and The imaging apparatus of any of claims        C1 through C7, wherein the imaging apparatus is operative so        that the imaging apparatus can sequentially activate the first        configuration and the second configuration during a trigger        signal activation period.        C8. The imaging apparatus of C1, wherein the first and second        rows of pixels are adjacent rows of pixels.        C9. The imaging apparatus of C1, wherein the first and second        rows of pixels are non-adjacent rows of pixels.        C10. The imaging apparatus of any of C1 though C9, wherein the        arrangement of two or more pixels is an arrangement of M×N        adjacent pixels, M>=2, N>=2.        C11. The imaging apparatus of any of C1 though C9, wherein the        arrangement of two or more pixels is an arrangement of 1×N        adjacent pixels, N>=2.        C12. The imaging apparatus of C1, wherein the imaging apparatus        is operative to attempt to decode a decodable indicia by        processing of one or more frame captured with the second        configurations active.        C13. The imaging apparatus of any of C1 though C12, wherein the        arrangement of two or more pixels in accordance with the second        configuration is an arrangement of M×N adjacent pixels, M>=2,        N>=2, and wherein the imaging apparatus includes a third        configuration in which the imaging apparatus is operative to        read out one or more frame of image data from the image sensor        array in accordance with a global shutter operation in which        exposure of pixels of the first and second rows of pixels of the        image sensor array is initiated and terminated simultaneously,        and wherein pixel values responsive to light incident on pixels        of the first and second rows of pixels subject to readout are        binned pixel values that are read out using shared global        shutter circuitry of the image sensor array and which represent        light incident on a spatial area delimited by an arrangement of        two or more pixels of the image sensor array, the arrangement of        two or more pixels in accordance with the third configuration        being an arrangement of 1×N adjacent pixels, N>=2.        D1. A method comprising:    -   providing and imaging apparatus having an image sensor array, an        imaging lens assembly for focusing an image onto the image        sensor array, wherein the imaging apparatus includes a first        configuration in which the imaging apparatus is operative to        read out one or more frame of image data from the image sensor        array in accordance with a rolling shutter operation in which        exposure of pixels of first and second rows of pixels of the        image sensor array is initiated sequentially, and wherein pixel        values responsive to light incident on pixels of the first and        second rows of pixels subject to readout are un-binned pixel        values that represent light incident on a spatial area delimited        by a single pixel of the image sensor array, wherein the imaging        apparatus includes a second configuration in which the imaging        apparatus is operative to read out one or more frame of image        data from the image sensor array in accordance with a global        shutter operation in which exposure of pixels of the first and        second rows of pixels of the image sensor array is initiated and        terminated simultaneously, and wherein pixel values responsive        to light incident on pixels of the first and second rows of        pixels subject to readout are binned pixel values read out using        shared global shutter circuitry of the image sensor array that        represent light incident on a spatial area delimited by an        arrangement of two or more pixels of the image sensor array; and    -   activating one or more of the first configuration and the second        configuration.        D2. The method of D1, wherein the activating includes activating        one or more of the first configuration and the second        configuration responsively to an operator input control.        D3. The method of any of D1 or D2, wherein the activating        includes activating one or more of the first configuration and        the second configuration responsively to one or more sensed        condition.        D4. The method of D3, wherein the one or more sensed condition        is an imaging apparatus to target distance.        D5. The method of any of D3 through D4, wherein the sensed        condition is sensed by processing of image data captured using        the imaging apparatus.        D6. The method of any of D3 through D4, wherein the sensed        condition sensed by processing of image data captured using the        imaging apparatus, the processing being a processing to        recognize a representation of a spatial feature.        D7. The method of any of D3 through D4, wherein the sensed        condition sensed by processing of image data captured using the        imaging apparatus, the processing being a processing to        recognize a representation of a spatial feature, the spatial        feature being a decodable indicia.        D8. The method of any of D3 through D7, wherein the activating        includes activating one or more of the first configuration and        the second configuration responsively to one or more a sensed        condition, the sensed condition being sensed during a trigger        signal activation period.        D9. The method of any of D1 through D8, wherein the activating        includes activating each of the first configuration and the        second configuration during a trigger signal activation period.        D10. The method of any of D1 through D2, wherein the activating        includes activating each of the first configuration and the        second configuration on an open loop basis during a trigger        signal activation period.        D11. The method any of D3 through D7, wherein the activating        includes activating each of the first configuration and the        second configuration responsively to one or more sensed        condition during a trigger signal activation period.        D12. The method of any of D1 through D11, wherein the activating        includes activating the first configuration for use of the        apparatus for document capture, and activating the second        configuration for use of the apparatus for reading of decodable        indicia.        D13. The method of any of D1 through D12, wherein the        arrangement of two or more pixels in accordance with the second        configuration is an arrangement of M×N adjacent pixels, M>=2,        N>=2, and wherein the providing further includes providing the        imaging apparatus to include a third configuration in which the        imaging apparatus is operative to read out one or more frame of        image data from the image sensor array in accordance with a        global shutter operation in which exposure of pixels of the        first and second rows of pixels of the image sensor array is        initiated and terminated simultaneously, and wherein pixel        values responsive to light incident on pixels of the first and        second rows of pixels subject to readout are binned pixel values        read out using shared global shutter circuitry of the image        sensor array that represent light incident on a spatial area        delimited by an arrangement of two or more pixels of the image        sensor array, the arrangement of two or more pixels in        accordance with the third configuration being an arrangement of        1×N adjacent pixels, N>=2.        D14. The method of D13, wherein the activating includes        activating the first configuration for use of the apparatus for        document capture, and activating the second configuration for        use of the apparatus for reading of decodable indicia at        relatively close range, and wherein the activating includes        activating the third configuration for use of imaging apparatus        for reading of decodable indicia at relatively long range.

While the present invention has been described with reference to anumber of specific embodiments, it will be understood that the truespirit and scope of the invention should be determined only with respectto claims that can be supported by the present specification. Further,while in numerous cases herein wherein systems and apparatuses andmethods are described as having a certain number of elements it will beunderstood that such systems, apparatuses and methods can be practicedwith fewer than or greater than the mentioned certain number ofelements. Also, while a number of particular embodiments have beendescribed, it will be understood that features and aspects that havebeen described with reference to each particular embodiment can be usedwith each remaining particularly described embodiment.

The invention claimed is:
 1. An imaging apparatus comprising: an imagesensor array for generating frames of image data, the image sensoryarray comprising shared global shutter circuitry; wherein the imagingapparatus, when in a first configuration, is configured for:sequentially initiating exposure of pixels of a first row and a secondrow of pixels of the image sensor array; and reading out a frame ofimage data from the image sensor array wherein pixel values areun-binned pixel values that represent light incident on a spatial areadelimited by a single pixel of the image sensor array; wherein theimaging apparatus, when in a second configuration, is configured for:simultaneously initiating exposure of pixels of a first row and a secondrow of pixels of the image sensor array; simultaneously terminatingexposure of pixels of the first row and the second row of pixels of theimage sensor array; and reading out a frame of image data from the imagesensor array using the shared global shutter circuitry, wherein pixelvalues are binned pixel values that represent light incident on aspatial area delimited by an arrangement of two or more pixels of theimage sensor array.
 2. The imaging apparatus of claim 1, wherein theimaging apparatus comprises a hand held housing.
 3. The imagingapparatus of claim 1, comprising an operator input for activating thefirst configuration and the second configuration.
 4. The imagingapparatus of claim 1, comprising a trigger for generating a triggersignal, wherein the imaging apparatus is configured for, in response tothe trigger signal, sequentially activating the first configuration andthe second configuration on an open loop basis.
 5. The imaging apparatusof claim 1, comprising a trigger for generating a trigger signal,wherein the imaging apparatus is configured for, in response to thetrigger signal, sequentially activating the first configuration and thesecond configuration on an open loop basis, wherein the secondconfiguration is activated prior to the first configuration.
 6. Theimaging apparatus of claim 1, comprising a trigger for initiating atrigger signal activation period, wherein the imaging apparatus isconfigured for, during the trigger signal activation period,sequentially activating the first configuration and the secondconfiguration.
 7. The imaging apparatus of claim 1, wherein the firstrow and the second row of pixels are adjacent rows.
 8. The imagingapparatus of claim 1, wherein the first row and the second row of pixelsare not adjacent rows.
 9. The imaging apparatus of claim 1, wherein thearrangement of two or more pixels is an arrangement of M×N adjacentpixels, wherein M≧2 and N≧2.
 10. The imaging apparatus of claim 1,wherein the arrangement of two or more pixels is an arrangement of 1×Nadjacent pixels, wherein N≧2.
 11. The imaging apparatus of claim 1,wherein the imaging apparatus is configured for attempting to decode adecodable indicia by processing a frame captured while the secondconfiguration is active.
 12. The imaging apparatus of claim 1, wherein:the arrangement of two or more pixels is an arrangement of M×N adjacentpixels, wherein M≧2 and N≧2; wherein the imaging apparatus, when in athird configuration, is configured for: simultaneously initiatingexposure of pixels of a first row and a second row of pixels of theimage sensor array; simultaneously terminating exposure of pixels of thefirst row and the second row of pixels of the image sensor array;reading out a frame of image data from the image sensor array using theshared global shutter circuitry, wherein pixel values are binned pixelvalues that represent light incident on a spatial area delimited by anarrangement of 1×N adjacent pixels, wherein N≧2.
 13. A methodcomprising: activating a first configuration or a second configuration;if the first configuration is activated: sequentially initiatingexposure of pixels of a first row and a second row of pixels of an imagesensor array comprising shared global shutter circuitry; and reading outa frame of image data from the image sensor array wherein pixel valuesare un-binned pixel values that represent light incident on a spatialarea delimited by a single pixel of the image sensor array; if thesecond configuration is activated: simultaneously initiating exposure ofpixels of a first row and a second row of pixels of the image sensorarray; simultaneously terminating exposure of pixels of the first rowand the second row of pixels of the image sensor array; and reading outa frame of image data from the image sensor array using the sharedglobal shutter circuitry, wherein pixel values are binned pixel valuesthat represent light incident on a spatial area delimited by anarrangement of two or more pixels of the image sensor array.
 14. Themethod of claim 13, comprising activating the first configuration or thesecond configuration in response to operator input.
 15. The method ofclaim 13, comprising activating the first configuration or the secondconfiguration in response to a sensed condition.
 16. The method of claim13, comprising: determining a distance between the image sensor arrayand a target; and activating the first configuration or the secondconfiguration based on the determined distance.
 17. The method of claim13, comprising: capturing image data using the image sensor array;processing the image data; and activating the first configuration or thesecond configuration based on the processed image data.
 18. The methodof claim 13, comprising: capturing image data using the image sensorarray; processing the image data in an effort to recognize arepresentation of a spatial feature; and activating the firstconfiguration or the second configuration based on the processed imagedata.
 19. The method of claim 13, wherein the arrangement of two or morepixels is an arrangement of M×N adjacent pixels, wherein M≧2 and N≧2.20. The method of claim 13, comprising: activating the firstconfiguration, the second configuration, or a third configuration; ifthe third configuration is activated: simultaneously initiating exposureof pixels of a first row and a second row of pixels of the image sensorarray; simultaneously terminating exposure of pixels of the first rowand the second row of pixels of the image sensor array; and reading outa frame of image data from the image sensor array using the sharedglobal shutter circuitry, wherein pixel values are binned pixel valuesthat represent light incident on a spatial area delimited by anarrangement of 1×N adjacent pixels, wherein N≧2.